It is reported that on December 2, 2024, the United States introduced chip export control measures for China, including stricter restrictions on the export of key semiconductor manufacturing tools, and prohibiting the export of advanced high-bandwidth memory (HBM) chips (key components of artificial intelligence products) to China.

On January 13, 2025, the United States further issued export controls on artificial intelligence chips, which creates a three-level licensing system for chips used to process artificial intelligence computing, while China is at the third level, and American companies cannot export products to third-level countries.

As early as September 2024, according to the South Korean Herald, the United States stepped up pressure on South Korea to cooperate with US export controls to China, urging South Korea to only provide advanced chips such as high-bandwidth memory (HBM) to its allies.