Local time on August 27, SK Hynix held a ground‑breaking ceremony for its HBM high‑bandwidth‑memory advanced‑packaging factory in Indiana, the United States. Total investment for the project exceeds 4 billion US dollars. The plant’s clean‑room facility is scheduled to go into operation in October 2028. Next‑generation HBM products are projected to start mass‑production in the second half of 2029. The firm aims to turn Indiana into a key US‑based HBM manufacturing hub.

The project qualifies for subsidies under the US CHIPS and Science Act, including up to 458 million US dollars in direct grants and 500 million US dollars in loans. HBM high‑bandwidth memory is a core component for modern AI‑computing servers. Expanding global AI‑computing capacity keeps driving robust HBM market demand. SK Hynix’s US‑based‑capacity expansion seeks to get closer to North‑American cloud‑service‑providers and mitigate supply‑chain risks stemming from geopolitical‑trade‑policy shifts.

Industry analysts note that major global memory‑chip manufacturers are accelerating advanced‑packaging‑capacity building inside the United States, which will reshape global HBM supply‑chain patterns. Washington uses subsidies to attract overseas semiconductor‑enterprises and strengthen domestic semiconductor‑manufacturing capabilities. Nevertheless, overseas‑factory construction faces real‑world hurdles including high operating costs, talent shortages and incomplete local‑supply‑chain supporting systems.

In capital markets, the HBM industrial chain has drawn heavy global‑investor interest. Analysts point out that overseas capacity expansion will alter industry‑supply dynamics and influence long‑term HBM‑product pricing trends. Markets will track project‑construction timelines, capacity‑ramp‑up progress and evolving global HBM supply‑and‑demand conditions.